Design Rules

	Betegnelse	Parameter	Standard	Min
A,B,C	Plated through hole	Aspect rate	1:8	1:12
		Finished hole	250 µm	150 µm
		Annularring	150 µm	100 µm
		Solder pad	600 µm	450 µm
D	Mechanical drilled blind via	Aspect rate	1 : 1	1: 1
	(After pressing)	Finished hole	250 µm	100 µm
		Annularring	150 µm	150 µm
		Solder pad	600 µm	450 µm
E	Laser drilled blind via	Aspect rate	1 : 1	1: 1
		Finished hole	75 µm	50 µm
		Annularring	75 µm	75 µm
		Solder pad	225µm	200 µm
F	Conductor, outer layer	Width	125 µm	75 µm
		Isolation	125 µm	75 µm
G	Conductor, inner layer	Width	125 µm	70 µm
		Isolation	125 µm	70 µm
H	Conductor/Solder pad – Contour	Space	400 µm	200 µm
I	Conductor/Solder pad - Hole	Space	275 µm	225 µm
J	Solder mask– Solder pad	Space	75 µm	50 µm
	Solder mask	Width	200 µm	100 µm
	Unplated hole	Annularring	400 µm	400 µm
	Legend – Solder mask	Space	150 µm	100 µm